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BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER

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BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER

Large Image : BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER

Product Details:

Place of Origin:	CHINA
Brand Name:	ZG
Certification:	CE
Model Number:	MS

Payment & Shipping Terms:

Minimum Order Quantity:	1 Piece
Price:	Negotiation
Packaging Details:	Strong wooden box for global shipping
Delivery Time:	7-10 work days
Payment Terms:	L/C, T/T, D/A, D/P, Western Union, MoneyGram
Supply Ability:	10000 pieces per month

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BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER

Description

Dimension(l*w*h):

Customized

Bond Type:

Electroformed, Metal (sintered), Resin, And Vitrified

Applicaiton:

Backgrinding Wheels

Feature:

Reduced Sub-surface Damage Excellent Wheel Wear Characteristics

Highlight:

CE MoSi2 Heating Elements

Backgrinding MoSi2 Heating Elements

Silicon Wafer Backgrinding Wheels

Backgrinding Wheels

Backgrinding Wheels, are mainly used for the thinning and fine grinding of the silicon wafer

Our diamond wheels offer durability and accuracy by employing the most advanced engineering techniques and precision processing for back grind thinning.

Our particle holding strength minimizes processing contamination and provides high consistency throughout the product’s life with reduced sub-surface damage. A variety of standard offering are available depending on the material to be processed, however we can custom adjust and modify our formulations to satisfy the unique nature of most applications.