Dimension(l*w*h):Customized
Bond type:electroformed, metal (sintered), resin, and vitrified
Applicaiton:Backgrinding Wheels
Dimension(l*w*h):Customized
Bond type:electroformed, metal (sintered), resin, and vitrified
Applicaiton:Silicon and compound semiconductor wafers,BGA, CSP, optical, sapphire, and etc.
Shape:round, square, rectangular or other customized shapes
Application:Wire drawing die
Feature:high strength, high hardness and high wearing property of diamond layer as well as good self-sharpening
Equipment - Machines:Superfinishing Machines
Mineral Type:Diamond
Product Form:Roll
Shape:round, square, rectangular or other customized shapes
Application:Wire drawing die
Feature:high strength, high hardness and high wearing property of diamond layer as well as good self-sharpening
Shape:round, square, rectangular or other customized shapes
Application:Wire drawing die
Feature:high strength, high hardness and high wearing property of diamond layer as well as good self-sharpening
Shape:round, square, rectangular or other customized shapes
Application:Oil/Gas Drilling And Mining Bits
Feature:high strength, high hardness and high wearing property of diamond layer as well as good self-sharpening
Shape:round, square, rectangular or other customized shapes
Application:Cutting Tools
Feature:high strength, high hardness and high wearing property of diamond layer as well as good self-sharpening
Shape:round, square, rectangular or other customized shapes
Application:Diamond tools
Feature:high strength, high hardness and high wearing property of diamond layer as well as good self-sharpening
Shape:round, square, rectangular or other customized shapes
Application:Diamond tools
Feature:high strength, high hardness and high wearing property of diamond layer as well as good self-sharpening
