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The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch

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The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch

The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch
The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch

Large Image :  The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch

Product Details:
Place of Origin: CHINA
Brand Name: ZG
Certification: CE
Model Number: MS
Payment & Shipping Terms:
Minimum Order Quantity: 1 piece
Price: USD10/piece
Packaging Details: Strong wooden box for Global shipping
Delivery Time: 3 working days
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 10000 pieces per month

The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch

Description
Application: Fine Chemical Industry, Pharmaceutical Industry, Environmental Protection Engineering Dimension: The Maximum Diameter Of Tube Bundle Block Can Reach 200mm, And The Height Can Be 500mm.
Material: Silicon Carbide Color: Black
Product Name: Silicon Carbide Tube Bundle Block
Highlight:

OEM Design Industrial Ceramic Parts

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OEM Silicon Carbide ICP Tray

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SIC ICP Tray Corrosion Resistant

 

SiC ICP Tray

 

 

Silicon carbide ICP tray is formed by isostatic pressing process and sintering at high temperature. The outer diameter, thickness, number and size of acupoints, position and shape of the tablet groove can also be finished according to the requirements of the user's design drawings to meet the specific requirements of the user.

 
 
Typical applications
  • The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etching.
 
Features and advantages
  • Good thermal conductivity, low coefficient of expansion and temperature uniformity
  • Plasma impact resistance
  • Can be made according to the specific size requirements of customers, the maximum diameter can reach 495MM
  • Resistant to all kinds of strong acid and alkali chemical reagent corrosion
 
Specifications:Diameter 330/380mm
The ICP (Inductively Coupled Plasma) etching process in LED chip manufacturing is called Inductively Coupled Plasma etch 0

Contact Details
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

Contact Person: Daniel

Tel: 18003718225

Fax: 86-0371-6572-0196

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