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Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

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Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications
Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

Large Image :  Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

Product Details:
Place of Origin: China
Brand Name: ZG
Certification: CE
Model Number: MS
Payment & Shipping Terms:
Minimum Order Quantity: 1PC
Price: 10USD/PC
Packaging Details: Strong wooden box
Delivery Time: 5-8 working days
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability: 1000PCS

Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications

Description
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High Brittleness Transparent Ceramic

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Low Thermal Expansion Brittle Ceramic

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Semiconductor Grade Technical Ceramic

Transparent Brittle Ceramic
Quartz glass, microcrystalline glass, sapphire, and other transparent materials are characterized by high brittleness and hardness. ZG has conducted extensive research on processing these advanced materials and currently supplies products for semiconductor, optical, and military industries. We offer various materials including high borosilicate glass, ultra-low expansion microcrystalline glass, and sapphire for applications in semiconductor windows, precision measuring instruments, space telescopes, microchannel reactors, and other specialized uses.
ZERODUR Low Thermal Expansion Glass-Ceramic
Physical Characteristics ZERODUR ZERODUR K20
Density (g/cm³) 2.53 2.53
Poisson's Ratio 0.24 0.25
Knoop Hardness HK 0.1/20 (ISO 9385) 620 620
Refractive Index nd 1.5424 -
Abbey Numbers vd 56.1 -
Thermal Conductivity (W/m·K) 1.46 1.63
Thermal Diffusion Coefficient at 20°C (10⁻⁶m²/s) 0.72 -
Specific Heat at 20°C (J/g·K) 0.80 0.90
Young's Modulus E (GPa) average at 20°C 90.3 84.7
Internal Transmittance Ti with 580nm/5mm thickness 0.95 -
Internal Transmittance Ti with 580nm/10mm thickness 0.9 -
Stress Optical Coefficient K (λ=589.3nm, 10⁻⁶MPa⁻¹) 3 -
Electric Resistivity ρ (Ω·cm) at 20°C 2.6×10¹³ -
Tk100°C, ρ=10⁸ (Ω·cm) humidity 178 -
Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications 0 Transparent Brittle Ceramic with High Brittleness and Low Thermal Expansion for Semiconductor Applications 1

Contact Details
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

Contact Person: Daniel

Tel: 18003718225

Fax: 86-0371-6572-0196

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