Aluminum Nitride Substrate

Aluminum Nitride Substrate

Product Advantages:
1. Standard thermal conductivity 175W/m·K, high thermal conductivity 200W/m·K, ultra-high thermal conductivity 230W/m·K.
2. Customization services available, capable of producing substrates such as milled type, ready-to-burn type, high bending resistance, high thermal conductivity, polished type, and laser-marked type.
3. Suitable for various metallization: DPC, DBC, TPC, AMB, thick film printing, thin film printing, etc.
4. Minimum thickness can reach 0.1mm.

Features: It has high mechanical strength, high heat resistance, and low cost.

Dimensions: The standard size of the sintered aluminum nitride substrate is 120mm x 120mm x 1mm, and it can also be customized according to customer requirements.

Applications: High-temperature tools, molten metal containers, solar cells, and other fields.

Item	Unit	NC-170	NC-200	NC-230
Color	-	Gray/Beige	Gray/Beige	Gray/Beige
Thermal conductivity	[@20°℃]w/m·k	$\ge$ 170	$\ge$ 195	$\ge$ 225
Bending Strength	MPa	>450	>380	>350
Surface Roughness	μm	<0.5	<0.8	<0.85
Volume Density	g/cm²	$\ge$ 3.3	$\ge$ 3.3	$\ge$ 3.3
Warpage	%0	<2.5	<2.5	<2.5
Coefficient of Linear Expansion	[RT-300℃]10-6mm/℃	4.6	4.6	4.6
Volume Resistance	20℃ Ω $=1\text{V}/\text{A}$·cm·cm$$	>10^14	>10^13	>10^13
Dielectric constant	[@1MHz]	9.0	8.7	8.5
Dielectric Loss	[@1MHz]	4.6*10^-4	4.6*10^-4	4.6*10^-4
Dielectric Strength	(KV/mm)	$\ge$ 15	$\ge$ 15	$\ge$ 15