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Product Details:
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| Dimension(l*w*h): | Customized | Bond Type: | Electroformed, Metal (sintered), Resin, And Vitrified |
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| Applicaiton: | Polishing Slurry | Product: | Polishing Abrasives |
| High Light: | Colloidal Silica Polishing Abrasives,Electroformed Lapping And Grinding Abrasives,Electroformed Colloidal Silica Polishing Abrasives |
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We manufacturers high grade materials for grinding, lapping, and polishing in a wide variety of applications, including semiconductor, LED, glass, plastics, and other metals. Our abrasive products are designed to meet the demands of our customers and provide the highest level of quality and consistency.
We offer polishing compounds and slurries specifically developed to provide the necessary surface finishes of many different types of materials. Slurries are formulated with special suspension agents and additives, and are available with different abrasive sizes.
GLANZOX is a colloidal silica suspended in liquid plus special ingredients. On semiconductor wafers, GLANZOX produces a near perfectly smooth surface down to the nanometer level.
In addition, GLANZOX greatly reduces the metal impurities that can be left by the polishing process.
Application: Silicon
Abrasive Type: Colloidal Silica
COMPOL is a colloidal silica slurry developed especially for polishing metals, ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and sapphire. With excellent particle uniformity and dispersal, it delivers a high removal rate and damage-free polishing.
Application: Ceramics, Sapphire, Metals, Lithium Niobate, Lithium Tantalate
Abrasive Type: Colloidal Silica
FZ consists of ultra-fine zirconium oxide particles and are optimal for polishing special metals such as molybdenum, tungsten, chromium, titanium, nickel, and their alloys. When used with a hard urethane pad and polishing pitch, FZ produces a deep, scratch-free luster to metals. You can also use FZ-02 for final polishing of optical lenses removing all scratches and bumps from the lens surface and eliminating interference in the transmitted light.
Application: Glass, Metals
Abrasive Type: Zirconia
CLEALITE is a polishing slurry that produces a mirror finish on all kinds of metals such as aluminum, stainless steel, and titanium. Depending on the type used, special additives are included to deliver a scratch free surface with a surface roughness of 10nm (Rmax). CLEALITE can also be used as a final polish for metals.
Application: Metals
Abrasive Type: Colloidal Silica
INSEC series produces a high-precision mirror finish on compound semiconductors materials. The INSEC series also works well as an etching agent for LED-related GaAs and GaP products.
All of the INSEC products come in the form of granules and must be dissolved before use.
Application: Gallium Arsenide, Gallium Phosphide, Indium Phosphide
Abrasive Type: Abrasive Granules
POLIPLA is a compound-type polishing slurry developed especially for plastic lenses. This high-purity alumina is uniformly dispersed in a special solution with a pH of about 3.0 to 4.0, which delivers excellent polishing performance and a high-quality finished surface. POLIPLA is available in a wide range of types allowing you to select the optimal solution for your needs. Types are also available that contain additives to prevent corrosion and foaming for applications subject to metal corrosion.
Application: Plastic Lens
Abrasive Type: Alumina
We offer a variety of lapping powders to fit the needs of the most critical applications. Strict quality control standards and tight particle distributions ensure that our loose abrasive products are consistent from batch-to-batch.
GC (green silicon carbide) is a very high-purity silicon carbide (SiC) lapping powder produced by reacting silica and coke in an electric furnace at a temperature greater than 2000° C. This process produces the following qualities:
The resulting product has superior lapping and polishing qualities that are not affected by chemicals and can generate sharp edges through fragmentation. GC is thus well-suited for many purposes.
Application: Crystals, Ferrite, Metals, Silicon, Lithium Niobate, Lithium Tantalate
Abrasive Type: Green Silicon Carbide
C is a black silicon carbide lapping powder commonly known as Carborundum. Like GC, C is produced by reacting silica and coke in an electric furnace at a temperature greater than 2000° C. This produces the following qualities:
C is excellent for abrasive machining and produces superior lapping on a work surface. C is thus ideal as a material for precision-lapping polishing cloths and papers as well as precision grindstones.
Application: Cast Iron, Brass, Copper, Aluminum, Stones, Glass
Abrasive Type: Black Silicon Carbide
PWA is a white calcined alumina abrasive powder consisting of plate-shaped crystals of aluminum oxide (Al2O3) with a purity of over 99.0%.
The particle size distribution is tightly controlled and produces a very fine lapped surface allowing a wide range of applications.
Application: Silicon, Crystals, Stainless Steel, Optics Materials
Abrasive Type: White Calcined Aumina
WA is a fused white alumina abrasive powder produced by crushing fused alumina and sorting the particles into a uniform size. The resulting compound has the following characteristics:
These characteristics make WA a superb choice for high-level surface polishing.
Application: Metals, Quartz Crystals
Abrasive Type: White Fused Alumina
A is the most widely known abrasive powder, popularly known as Arundum. Fujimi produces A by melting bauxite in an electric furnace at a temperature of 2000° C to obtain aluminum oxide (Al2O3) corundum crystal of at least 90% purity.
In addition, the process fuses crystals with a small percentage of titanium, which increases the toughness (tenacity) of the abrasive particles. As a result, A has the highest degree of toughness of all Fujimi abrasive powders. Fujimi manufactures A for a consistent distribution of particle sizes for a highly efficient, highly stable abrasive.
Application: Soft Metals, Glass, Cathode Ray Tubes
Abrasive Type: Fused Alumina
FO is an alumina-based powder designed especially for precise lapping of semiconductor wafers. FO has a special particle shape and hardness that leaves no scratches on the surface being polished. These same qualities also make FO a superior lapping agent for lenses, prisms, and other optical glassware.
Application: Gallium Arsenide, Gallium Phosphide, Silicon, Hardened Glass, Crystals, Optical Glass
Abrasive Type: Alumina & Zirconia Blend
Please contact us for additional information.
Contact Person: Daniel
Tel: 18003718225
