Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding

Name: Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding
Brand: HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
SKU: MS
Price: 10 USD
Availability: InStock

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Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding

Large Image : Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding

Product Details:

Place of Origin:	China
Brand Name:	ZG
Certification:	CE
Model Number:	MS

Payment & Shipping Terms:

Minimum Order Quantity:	1PC
Price:	10USD/PC
Packaging Details:	Strong wooden box for Global shipping
Delivery Time:	5-8 working days
Payment Terms:	D/A,L/C,D/P,T/T,Western Union,MoneyGram
Supply Ability:	1000PCS

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Ceramic Lapping Discs for High Machining Efficiency and Good Flatness in Double-Sided Grinding

Description

Highlight:

High Machining Efficiency Ceramic Lapping Discs

Good Flatness Ceramic Grinding Discs

Double-Sided Grinding Ceramic Polishing Discs

Ceramic Lapping Discs

This advanced ceramic disc series is engineered for precision carving, thinning, shaping, beveling, and polishing of gemstones, ceramics, and crystals. The product line includes grinding discs, files, grinding plates, and resin discs designed for industrial manufacturing applications.

Semiconductor Silicon Wafer Processing

Ceramic grinding discs represent the most advanced method for processing semiconductor silicon wafers. The double-sided grinding process utilizes ceramic discs to significantly enhance wafer quality through optimized grinding parameters including disc material composition, grinding fluid selection, pressure control, and rotational speed.

By replacing traditional cast iron discs with ceramic alternatives, manufacturers eliminate surface scratches and contamination, minimize metal ion introduction, reduce subsequent processing requirements, shorten etching times, improve production efficiency, and significantly decrease silicon wafer processing losses—dramatically increasing overall utilization rates.

Product Specifications & Features

Primary Utility: Precision thickness reduction of gemstones and materials
Construction: Metal bond and vitrified bond configurations
Grit Sizes: 350# and 600# options available
Disc Diameters: Range from 400mm to 960mm
Key Advantages: Exceptional machining efficiency and superior product flatness

Physical Performance Indicators

Performance Metric	ZG Ceramics	Domestic Level	International Standards
Density (g/cm³)	3.97	3.81-3.93	3.9-3.94
Purity (%)	99.9	98-99.8	99.5-99.9
Vickers Hardness (GPa)	17	14-15	16-17.5
Three-Point Bending Strength	520	300-350	330-400

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Contact Person: Daniel

Tel: 18003718225

Fax: 86-0371-6572-0196

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