Product Details:
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Shape: | Round, Square, Rectangular Or Other Customized Shapes | Application: | Filler For Semiconductor Sealing Resin |
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Specific Gravity: | 3.6g/cm3 | Melting Point: | 2050℃ |
Highlight: | White D50 Sphercial Alumina Powder,Sphercial Alumina Powder 3.60g/Cm3,3.60g/Cm3 alumina ceramic powder |
SPHERCIAL ALUMINA POWDER FOT HIGH THERMAL CONDUCTIVE MATERIAL
Sphercial Alumina Powder Fot High Thermal Conductive Material
This product is a spherical alumina powder with high globularity with high thermal conductivity, developed by high temperature melting technologies and indicates excellent characteristics for rubber and plastic filler and ceramic base material.
Specifications:
Type |
D50(um) |
S.S.A.(m2/g) |
SA-05 |
5±1 |
0.60 |
SA-10 |
10±2 |
0.50 |
SA-20 |
20±3 |
0.40 |
SA-30 |
30±3 |
0.30 |
SA-40 |
40±5 |
0.20 |
SA-70 |
70+/-6 |
0.12 |
Physical Property:
Appearance | White powder |
Specific Gravity (g/cm3) | 3.60 |
Melting point (℃) | 2050 |
Moisture (%) | ≤ 0.05 |
EC(uS/cm) | ≤ 10 |
PH | 7.0±0.5 |
α-Al2O3 Cotent(%) | ≥ 90 |
Spherical particles ratio(%) | ≥ 95 |
Chemical Property:
Type | Chemical Composition | ||||||
Al2O3% ≥ | SiO2% ≤ | Fe2O3% ≤ | Na2O%≤ | K2O% ≤ | MgO%≤ | CaO% ≤ | |
SA-05 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
SA-10 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
SA-20 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
SA-30 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
SA-40 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
SA-70 | 99.0 | 0.05 | .05 | 0.02 | 0.01 | 0.01 | 0.01 |
Character:
2. High thermal conductivity: High filling density enables production of compounds with higher thermal conductivity and higher heat dissipation rate compared to crystalline silica.
3. Low abrasivity: Due to its Spherical shape, less-wearing of kneading machines, forming machines and dies.
Applications:
1. Filler for heat sink sheet, filler for heat dissipation board (MC board), heat dissipating
grease, phase change sheet
2. Filler for semiconductor sealing resin
3. Silicone-based heat dissipating adhesive, filler for compound
4. Ceramic filler
Contact Person: Daniel
Tel: 18003718225
Fax: 86-0371-6572-0196