|
Product Details:
|
| Highlight: | Ultrasonic vibration machining ceramics,Aluminum silicon carbide ceramic parts,Technical ceramic parts with warranty |
||
|---|---|---|---|
Ultrasonic Vibration Machining of Aluminum-Based Silicon Carbide Ceramics —— High-Precision, Low-Damage Machining Solutions for AlSiC Metal Matrix Composites (MMCs)
Aluminum-based silicon carbide (AlSiC) composites combine the light weight and high thermal conductivity of aluminum with the extreme hardness and low thermal expansion of silicon carbide ceramics. However, due to the sharp mismatch in mechanical properties between the soft aluminum matrix and ultra-hard SiC ceramic particles, conventional machining suffers from severe tool abrasive wear, particle pull-out, surface pitting, and micro-cracking. Ultrasonic Vibration Machining (UVM) of Aluminum-Based Silicon Carbide Ceramics superimposes high-frequency micro-vibrations ($20 text{kHz} sim 40 text{kHz}$) onto PCD/diamond tools, significantly reducing cutting forces and delivering superior surface integrity on complex AlSiC components.
Significant Cutting Force Reduction: High-frequency micro-separation between the cutting tool edge and workpiece reduces average cutting forces by 30% to 50%, minimizing tool deflection and workpiece vibration.
Suppression of Particle Pull-Out & Pitting: Ultrasonic impact kinematic action promotes clean brittle fracturing and micro-shearing of SiC particles rather than pulling them out of the aluminum matrix, ensuring smooth, defect-free surfaces.
Extended PCD/Diamond Tool Lifespan: Intermittent cutting action lowers operating cutting zone temperatures and prevents aluminum matrix adhesion/built-up edge (BUE), extending tool life by 2 to 5 times compared to standard CNC machining.
High Dimensional Precision & Edge Integrity: Prevents edge chipping, burr formation on the ductile aluminum phase, and subsurface micro-cracks, achieving tight tolerances on complex geometries.
| Industry Sector | Target Component | Machining Objective & Requirements |
| Electronics & Power Modules | High-power IGBT baseplates, CPU heat sinks | High flatness ($le 5 mutext{m}$), mirror surface finish ($Ra le 0.2 mutext{m}$) for thermal transfer |
| Aerospace & Defense | Avionics electronic packaging, satellite structural brackets | High strength-to-weight ratio, zero-burr precision mounting holes, complex lightweight pocketing |
| Optics & Optoelectronics | Space mirror substrates, optoelectronic housing structures | Ultra-low surface roughness, dimensional stability across extreme temperature cycles |
| Automotive & Rail Transit | Brake rotors, high-temperature sensor housings, power module plates | High wear resistance, tight hole location tolerances, burr-free chamfers |
Contact Person: Daniel
Tel: 18003718225
Fax: 86-0371-6572-0196